RESTON, Va. – Packaging Machinery Manufacturers Institute (PMMI), The Association for Packaging and Processing Technologies, awarded three $5,000 scholarships to students studying food and beverage processing, mechanical engineering and electrical engineering at four-year PMMI partner schools.
The winners of these new scholarships are:
• Jenna Fowler, Oklahoma State Univ., Processing
• Lucas Morgan, Univ. of Wisconsin – Stout, Mechanical Engineering
• Joshua Siegel, Rutgers Univ. Electrical Engineering
“These students represent the potential of the next generation workforce to transform the packaging and processing industries,” said Kate Fiorianti, education manager, PMMI. “The application criteria, including the 3.0 GPA requirement and industry involvement criteria, means we truly are recognizing the best and brightest and giving them the resources to transfer academic success into professional excellence.”
The PMMI Foundation awards over $200,000 in funds each year for students at part schools of PMMI.
The Pack Expo International will be held from Oct. 14-17 in Chicago at McCormick Place. The show will be hosted by the Packaging Machinery Manufacturers Institute (PMMI), The Association for Packaging and Processing Technologies, and co-located with the Healthcare Packaging Expo. The three-day event will span more than 1.2 million net sq. ft. of exhibit space.